SEMIKRON
  • SKiiP¡Ëc2,3
  • l 1700v
    SKiiP¡Ëc2,3 600v |  1200v |  1700v
    SKiM¡Ëc IGBT Six Pack Modules
    SEMITRANS 600v |  1200v |  1700v
    MiniSKiiP CIB Modules
    SEMITOP IGBT/MOS/Thyristor/Diode Modules for wave soldering
     
  • Explanations SKiiP¢ç Systems
  • SKiiP¢ç 2,3 Heatsink-Drilling
  • SKiiP¢ç2,3 Type Designation System
  • Terminology
  •  
    Summary of standard 1700V-SKiiP¢ç2,3 with IGBT and freewheeling CAL-Diode?/sup>
    Type Circuit VCES/ V IC/ A5 IRMS1 IRMS2 Options3 Case Interface
    SKiiP¢ç2 - PREFERRED standard types with IGBT and freewheeling CAL-Diode?/sup>
    792 GB 170 - 373 CTV 2-pack 1700 750 341 250 U,L,W,F S3 GB
    1092 GB 170 - 474 CTV 2-pack 1700 1000 406 305 U,L,W,F S4 GB
    SKiiP¢ç2 - Standard types with IGBT and freewheeling CAL-Diode?/sup>
    192 GD 170 - 374 CTV 6-pack 1700 150 197 70 U,L,W S3 GD
    292 GD 170 - 375 CTV 6-pack 1700 250 115 84 U,L,W S3 GD
    592 GB 170 - 271 CTV 2-pack 1700 500 262 185 U,L,W,F S2 GB
    792 GB 170 - 373 CTV 2-pack 1700 750 341 250 U,L,W,F S3 GB
    1092 GB 170 - 474 CTV 2-pack 1700 1000 406 305 U,L,W,F S4 GB
    292 GH 170 - 273 CTV 4-pack 1700 250 136 100 U,L,W S2 GH
    592 GH 170 - 2*271 CTV6) 4-pack 1700 500 230 173 U,L,W,F S5GH 2 x GB
    SKiiP¢ç3 standard types (preliminary)
    513GD172-3DU 6-pack 1700 500 215 150 L, W S33 GD
    1013GB172-2D 2-pack 1700 1000 492 325 F, L, W S23 GB
    1203GB172-2D 2-pack 1700 1200 800 525 F, L, W S23 GB
    1513GB172-3D 2-pack 1700 1500 638 435 U, F, L, W S33 GB
    1803GB172-3D 2-pack 1700 1800 1124 660 U, F, L, W S33 GB
    2013GB172-4D 2-pack 1700 2000 761 540 U, F, L, W S43 GB
    2403GB172-4D 2-pack 1700 2400 1440 900 U, F, L, W S43 GB
     
    Non standard types on request. Please find latest information on internet page http://www.semikron.com/ or contact your local SEMIKRON - representative. For electrical and thermal design support please use SEMISEL. Access to SEMISEL is via SEMIKRON website http://semisel.semikron.com/. Further questions can be placed on internet page http://faq.semikron.com/.

    Features
    • Low thermal impedance
    • Optimal thermal management with integrated heatsink
    • Pressure contact technology with increased power cycling capability
    • Compact design
    • Low stray inductance
    • High power, small losses
    • Fast and soft recovery CAL diode
    • Recycable
    • Integrated current sensors
    • Integrated driver with
    • Overtemperature protection
    • Overcurrent protection due to current sensors
    • Overvoltage protection (DC-link) (-option-)
    • Built-in dead time and interlock
    • CMOS compatible inputs
    • Fiber optic connector (option for halfbridges)
    Typical Applications
    • Half, Fullbridges and H-bridges
    • Three phase motor drive inverter
    • Uninterruptable power supplies UPS
    • Converter
    • General power switching supplies
    • Inductive heating
    • DC Chopper

    1. Output rms-phase-current with typical operating conditions as shown in table below, SKiiP 2 mounted on P16 heat sink with standard fan SKF16B-230-01

    VCES/V VV/V VD/V cos phi fsw/kHz fout/Hz Tjmax/¡ÆC Ta/¡ÆC
    1700 690 1100 0.85 2 50 125 40

    2. Output rms-phase-current with operating conditions as above but 150% overload capability for 60s and fout=2Hz - 50 Hz
    3. Available options:
    U: DC-link voltage sense and over-voltage protection
    F: Fiber optic connector
    E: brake chopper voltage levels for 400V mains voltage (for 1200V-SKiiP only)
    A: brake chopper voltage levels for 460V mains voltage (for 1200V-SKiiP only)
    L: SKiiP?/SUP>2,3 mounted on P16 (SKiiP?/SUP>3: PX16 except SKiiP?/SUP>313GD122-3DUL, SKiiP?/SUP>413GD061-3DUL) heat sink for air cooling
    W: SKiiP 2,3 mounted on NWK40 heat sink for liquid cooling
    5. Current per switch @ 25 ¡ÆC heat sink temperature temperature
    6. This type has two gate drivers; when Option "U" is ordered only one gate driver is equipped with Option "U"
    7. Maximum continuous current is limited by current sensor capability