SEMIKRON
  • MiniSKiiP
  • l CIB Modules
    SKiiP¡Ëc2,3 600v |  1200v |  1700v
    SKiM¡Ëc IGBT Six Pack Modules
    SEMITRANS 600v |  1200v |  1700v
    MiniSKiiP CIB Modules
    SEMITOP IGBT/MOS/Thyristor/Diode Modules for wave soldering
     
    Former Datasheets not for new design MiniSKiiP¢çII
     
    Circuits
    Circuit 1 Circuit 2
       
    Circuit 3 Circuit 4
       
    Circuit 5 Circuit 6
       


    Cases
    MiniSKiiP¢ç II 1
    MiniSKiiP¢ç II 2
    MiniSKiiP¢ç II 3



    Features
    • High level power integration
    • One- or two-screws-mounting to the customer heatsink, compact design
    • Low thermal impedance due to durable ceramic insulation
    • Pressure contact technology with simple connection to DCB through pressure contact (no soldering) and with increased power cycling capability
    • Low stray inductance
    • High power density, low losses
    • Integrated temperature sensor
    • Open Emitter im MiniSKiiP (R) II 1 for optional current shunts on customer PCB
    • Ample space for SMT components beneath pressure lid

    Typical Applications
    • Three phase motor drive inverter
    • Uninterruptable power supplies UPS
    • Converter
    • General power switching supplies